|Axes||Working Voltage(V)||Full Scale Ranges (g)||Sensitivity(LSB/g)||Interface||Output Data Rates(Hz)|
|3(XYZ)||1.8~3.6||+/-2 ,+/-4 ,+/-8||1024 @ +/-2g||I2C||100|
The Three-Axis Thermal Accelerometer is based on Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the "click" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g. This sensor provides X/Y/Z axis acceleration signals with very low 0g offset, and temperature signal with high accuracy. In addition, it detects six orientation positions, X/Y shake and shake directions.